Electronics Forum: thermal stress testing (Page 4 of 59)

FR4 boards Delamination Cause?

Electronics Forum | Wed May 07 21:20:53 EDT 2008 | davef

Causes of Delamination ["Quality Assessment of Printed Circuit Boards" Lund, Preben; Bishop Graphics 1985 0137450354] The reason for delamination is epoxy starvation in the glass cloth layers or an incomplete curing of the base material. It has been

Re: Qualifying new PWB Vendors

Electronics Forum | Sat Jan 16 02:43:21 EST 1999 | Earl Moon

| Hello, | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | So far, the tests I can think of performing, and that we have

Re: Qualifying new PWB Vendors

Electronics Forum | Fri Jan 15 16:55:50 EST 1999 | Chrys

| | | Hello, | | | | | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | | | | | So far, the tests I can think of performin

Re: Qualifying new PWB Vendors

Electronics Forum | Fri Jan 15 17:13:07 EST 1999 | Earl Moon

| | | | Hello, | | | | | | | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | | | | | | | So far, the tests I can think of

Re: haloing on SMT PCBs

Electronics Forum | Mon Jun 08 15:00:08 EDT 1998 | Earl Moon

| I work QA at an OEM in Alberta, Canada. I saw earlier posts on the smtnet regarding PCB haloing criteria. I am currently in a dispute with my PCB vendor over the acceptability of haloing (delamination) around plated through holes and vias on a lot

BGA re-balling yields

Electronics Forum | Thu Apr 30 14:41:46 EDT 2009 | bandjwet

There was a paper recently presented by R Cirimele at the CALCE Reliability symposium in which extensive testing was done on a part (thermal stress, vibration, shock) after numerous reballing cycles. This show no failures on the reballed parts. In t

Re: Suspected Pink Ring

Electronics Forum | Wed Jul 28 16:36:30 EDT 1999 | Earl Moon

| | | While inspecting incoming PCBs we detected around all plated-through-holes (only there and all in the same place) some halfmoonshaped light rings that match obviously only with the pink ring symptom shown in the IPC-A-600 chapter 2.5.2.. That w

Re: Good Solder Joint Failures

Electronics Forum | Mon Feb 15 17:57:01 EST 1999 | Earl Moon

| Hope some of you out there can help me with this one. | I am getting feedback from our test department that they are showing opens on solder joints which have visually good wetting. The touch-up operators confirm that the joint looks good. All they

Re: Voids - correlation with a not wetting PCB

Electronics Forum | Mon Oct 12 08:07:45 EDT 1998 | Earl Moon

| I have datas to substain that a not wetting PCB ( the HAL oxided or not uniform in thickness )if soldered in reflow, it shows voids with X-Ray inspection.The voids are in side all the joints not only on the solder pads levell. | | Is there a techn

Bare PCB reflow

Electronics Forum | Tue Sep 07 17:12:34 EDT 2004 | davef

No one knows what type of board you use. So, assuming you're talking a fairly standard FR4. Q1a. actually, what is max temperature and duration can a bare PCB reflow without any quality problem? A1a. We'd guess your board could take 250*C for may


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